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    半导体封装/ 玻璃用切割砂轮修整板Dressing Plate for Cutting Blades Used in Semiconductor Package or Glass

    • 发布时间:2021-01-01
    • 浏览:

    半导体封装/ 玻璃用切割砂轮修整板Dressing Plate for Cutting Blades Used in Semiconductor Package or Glass(图1)

    产品介绍 Product info

    半导体封装用切割砂轮修整板一般为为陶瓷结合剂和树脂结合剂,磨料为碳化硅或者刚玉,主要用于半导体封装和玻璃用切割砂轮的整形和开刃。

    The dressing plate, which is for cutting blades used in semiconductor package, mainly consists of ceramic or resin as bond and silicon carbide or corundum as abrasive. It is for truing and dressing the blades, which is used in cutting semiconductor package and glass.

     

    主要特点

    1. 锋利性高,修整效果好;

    2. 粒度、浓度可控,可选择性广;

    3. 规格尺寸和厚度可根据切割砂轮特性定制。

    Main Characteristics

    1.Fine sharpness with good dressing and truing effect.

    2.Controllable granularity and concentration for wide selectivity.

    3.Specification, including size and thickness, could be customized by the characteristics of the cutting blades.

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